CI 9261 MICRO MACHINING METHODS SYLLABUS | ANNA UNIVERSITY ME COMPUTER INTEGRATED MANUFACTURING ELECTIVES SYLLABUS REGULATION 2009 2011 2012-2013 BELOW IS THE ANNA UNIVERSITY M.E COMPUTER INTEGRATED MANUFACTURING DEPARTMENT ELECTIVES SYLLABUS, TEXTBOOKS, REFERENCE BOOKS,EXAM PORTIONS,QUESTION BANK,PREVIOUS YEAR QUESTION PAPERS,MODEL QUESTION PAPERS, CLASS NOTES, IMPORTANT 2 MARKS, 8 MARKS, 16 MARKS TOPICS. IT IS APPLICABLE FOR ALL STUDENTS ADMITTED IN THE YEAR 2011 2012-2013 (ANNA UNIVERSITY CHENNAI,TRICHY,MADURAI,TIRUNELVELI,COIMBATORE), 2009 REGULATION OF ANNA UNIVERSITY CHENNAI AND STUDENTS ADMITTED IN ANNA UNIVERSITY CHENNAI DURING 2010
CI 9261 MICRO MACHINING METHODS L T P C
3 0 0 3
AIM:
The Purpose of this subject is to understand the principles of various micro
fabrication processes.
OBJECTIVES:
Upon completion of this subject, student will be able to:
1. Understand principle of Microsystems and feed back systems
2. Know the different methods of micro fabrication.
3. Understand the properties and microstructure of materials
4. Appreciate integration processes in detail.
5. Enhance his/her knowledge in semiconductor manufacturing processes.
UNIT I INTRODUCTION 8
Introduction to Micro System design, Material properties, micro fabrication
Technologies. Structural behavior, sensing methods, micro scale transport – feed
back systems.
UNIT II MICROMECHANICS 9
Microstructure of materials, its connection to molecular structure and its
consequences on macroscopic properties – Phase transformations in crystalline
solids including marten site, ferroelectric, and diffusional phase transformations,
twinning and domain patterns, smart materials.
UNIT III MICRO-FABRICATION 10
Bulk processes – surface processes – sacrificial processes and Bonding processes –
special machining: Laser beam micro machining-Electrical Discharge Machining –
Ultrasonic Machining- Electro chemical Machining. Electron beam machining. Clean
room-yield model – Wafer IC manufacturing – PSM – IC industry-New Materials-
Bonding and layer transfer-devices.
UNIT IV MECHANICAL MICROMACHINING 10
Theory of micromachining-Chip formation-size effect in micromachining-microturning,
micromilling, microdrilling- Micromachining tool design-Precision Grinding-Partial
ductile mode grinding-Ultraprecision grinding- Binderless wheel – Free form optics.
UNIT V MICRO ELECTRO MECHANICAL SYSTEM FABRICATION 8
Introduction – advance in Micro electronics – characteristics and Principles of MEMS
– Design and application of MEMS: Automobile, defence, healthcare, Aerospace,
industrial properties etc., - Materials for MEMS – MEMS fabrication- Bulk Micro
Machining-LIGA – Microsystems packaging- Future of MEMS.
TOTAL: 45 PERIODS
TEXT BOOK:
1. Sámi Franssila, “Introduction to Micro Fabrication”, John Wiley and sons Ltd., UK,
2004, ISBN: 978-0-470-85106-7.
19
REFERENCES:
1. Madore J, “fundamental of Micro fabrication”, CRC Press, 2002.
2. Mark J. Jackson, “Micro fabrication and Nanomanufacturing”, CRC Press, 2006.
3. Peter Van Zant, “Microchip fabrication”, McGraw Hill, 2004.
4. Mohamed Gad-el-Hak, “The MEMS Handbook”, CRC Press, 2006.
CI 9261 MICRO MACHINING METHODS L T P C
3 0 0 3
AIM:
The Purpose of this subject is to understand the principles of various micro
fabrication processes.
OBJECTIVES:
Upon completion of this subject, student will be able to:
1. Understand principle of Microsystems and feed back systems
2. Know the different methods of micro fabrication.
3. Understand the properties and microstructure of materials
4. Appreciate integration processes in detail.
5. Enhance his/her knowledge in semiconductor manufacturing processes.
UNIT I INTRODUCTION 8
Introduction to Micro System design, Material properties, micro fabrication
Technologies. Structural behavior, sensing methods, micro scale transport – feed
back systems.
UNIT II MICROMECHANICS 9
Microstructure of materials, its connection to molecular structure and its
consequences on macroscopic properties – Phase transformations in crystalline
solids including marten site, ferroelectric, and diffusional phase transformations,
twinning and domain patterns, smart materials.
UNIT III MICRO-FABRICATION 10
Bulk processes – surface processes – sacrificial processes and Bonding processes –
special machining: Laser beam micro machining-Electrical Discharge Machining –
Ultrasonic Machining- Electro chemical Machining. Electron beam machining. Clean
room-yield model – Wafer IC manufacturing – PSM – IC industry-New Materials-
Bonding and layer transfer-devices.
UNIT IV MECHANICAL MICROMACHINING 10
Theory of micromachining-Chip formation-size effect in micromachining-microturning,
micromilling, microdrilling- Micromachining tool design-Precision Grinding-Partial
ductile mode grinding-Ultraprecision grinding- Binderless wheel – Free form optics.
UNIT V MICRO ELECTRO MECHANICAL SYSTEM FABRICATION 8
Introduction – advance in Micro electronics – characteristics and Principles of MEMS
– Design and application of MEMS: Automobile, defence, healthcare, Aerospace,
industrial properties etc., - Materials for MEMS – MEMS fabrication- Bulk Micro
Machining-LIGA – Microsystems packaging- Future of MEMS.
TOTAL: 45 PERIODS
TEXT BOOK:
1. Sámi Franssila, “Introduction to Micro Fabrication”, John Wiley and sons Ltd., UK,
2004, ISBN: 978-0-470-85106-7.
19
REFERENCES:
1. Madore J, “fundamental of Micro fabrication”, CRC Press, 2002.
2. Mark J. Jackson, “Micro fabrication and Nanomanufacturing”, CRC Press, 2006.
3. Peter Van Zant, “Microchip fabrication”, McGraw Hill, 2004.
4. Mohamed Gad-el-Hak, “The MEMS Handbook”, CRC Press, 2006.
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