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Monday, February 18, 2013

MF9224 MEMS & NANO TECHNOLOGY SYLLABUS | ANNA UNIVERSITY ME MANUFACTURING ENGINEERING 2ND SEMESTER SYLLABUS REGULATION 2009 2011 2012-2013

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MF9224 MEMS & NANO TECHNOLOGY SYLLABUS | ANNA UNIVERSITY ME MANUFACTURING ENGINEERING 2ND SEMESTER SYLLABUS REGULATION 2009 2011 2012-2013 BELOW IS THE ANNA UNIVERSITY M.E MANUFACTURING ENGINEERING DEPARTMENT 2ND Sem SYLLABUS, TEXTBOOKS, REFERENCE BOOKS,EXAM PORTIONS,QUESTION BANK,PREVIOUS YEAR QUESTION PAPERS,MODEL QUESTION PAPERS, CLASS NOTES, IMPORTANT 2 MARKS, 8 MARKS, 16 MARKS TOPICS. IT IS APPLICABLE FOR ALL STUDENTS ADMITTED IN THE YEAR 2011 2012-2013 (ANNA UNIVERSITY CHENNAI, TRICHY, MADURAI, TIRUNELVELI, COIMBATORE), 2009 REGULATION OF ANNA UNIVERSITY CHENNAI AND STUDENTS ADMITTED IN ANNA UNIVERSITY CHENNAI DURING 2010

MF9224 MEMS & NANO TECHNOLOGY L T P C
3 0 0 3
AIM:
To inspire the students to expect to the trends in manufacturing micro components and
measuring systems to nano scale.
OBJECTIVES:
 To expose the students to the evolution of micro electromechanical systems, to the
various fabrication techniques and to make students to be award of micro
actuators.
 Also to impart knowledge to the students about nano materials and various nano
measurements techniques.
UNIT I OVER VIEW OF MEMS AND MICROSYSTEMS 6
Definition – historical development – fundamentals – properties, micro fluidics, design
and fabrication micro-system, microelectronics, working principle and applications of
micro system.
UNIT II MATERIALS, FABRICATION PROCESSES AND MICRO SYSTEM
PACKAGING 10
Substrates and wafers, silicon as substrate material, mechanical properties of Si, Silicon
Compounds silicon piezo resistors, Galium arsenide, quartz, polymers for MEMS,
conductive polymers. Photolithography, photo resist applications, light sources, in
implantation, diffusion process exudation – thermal oxidation, silicon diode, chemical
vapour deposition, sputtering - deposition by epitoxy – etching – bulk and surface
machining – LIGA process Micro system packaging – considerations packaging – levels
of micro system packaging die level, device level and system level.
UNIT III MICRO DEVICES AND MATERIALS 8
Sensors – classification – signal conversion ideal characterization of sensors micro
actuators, mechanical sensors – measurands displacement sensors, pressure and flow
sensors, micro actuators – smart materials – applications.
UNIT IV SCIENCE OF NANO MATERIALS 10
Classification of nano structures – effect of the nanometer length scale effects of nano
scale dimensions on various properties – structural, thermal, chemical, mechanical,
magnetic, optical and electronic properties – effect of nanoscale dimensions on
biological systems. Fabrication methods – Top down processes – bottom up process.
7
UNIT V CHARACTERIZATION OF NANO MATERIALS 11
Nano-processing systems – Nano measuring systems – characterization – analytical
imaging techniques – microscopy techniques, electron microscopy scanning electron
microscopy, transmission electron microscopy, transmission electron microscopy,
scanning tunneling microscopy, atomic force microscopy, diffraction techniques –
spectroscopy techniques – Raman spectroscopy, 3D surface analysis – Mechanical,
Magnetic and thermal properties – Nano positioning systems.
TOTAL: 45 PERIODS
REFERENCES:
1. Tai – Ran Hsu, MEMS and Microsystems Design and Manufacture, Tata-McGraw
Hill, New Delhi, 2002.
2. Mark Madou Fundamentals of Microfabrication, CRC Press, New York, 1997.
3. Norio Taniguchi, Nano Technology, Oxford University Press, New York, 2003
4. The MEMS Hand book, Mohamed Gad-el-Hak, CRC Press, New York, London.
5. Charles P Poole, Frank J Owens, Introduction to Nano technology, John Wiley and
Sons, 2003
6. Julian W. Hardner Micro Sensors, Principles and Applications, CRC Press 1993.

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