CM7017 MICROELECTROMECHANICAL SYSTEMS Syllabus | Anna University ME

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Anna University Syllabus - Anna University ME Syllabus

CM7017 MICROELECTROMECHANICAL SYSTEMS Syllabus | Anna University ME Computer Integrated Manufacturing Second Semester Syllabus Regulation 2013. Below is the Anna University 2013 Regulation Syllabus for 2nd Semester for ME Computer Integrated Manufacturing, Textbooks, Reference books, Exam portions, Question Bank, Previous year question papers, Model question papers, Class notes, Important 2 marks, 8 marks, 16 marks topics.
It is applicable for all students admitted in the Academic year 2013-2014 onwards for all its Affiliated institutions in Tamil Nadu.

CM7017 MICROELECTROMECHANICAL SYSTEMS L T P C 3 0 0 3

OBJECTIVE:
 To impart knowledge of design, fabrication and characterization of Micro Electro Mechanical
systems.
UNIT I INTRODUCTION 9
Overview of MEMS and Microsystems: MEMS and Microsystems, Evolution of Micro
fabrication,Microsystems and Microelectronics, Microsystems and miniaturization-Materials for MEMS
and Microsystems: substrates and wafers, active substrate materials, Silicon, Gallium Arsenide,
Piezoelectric Crystals, Polymers, Packaging materials-Working principles of Microsystems: micro
sensors, micro actuation, MEMS with micro actuators, Micro accelerometers, micro fluidics-
Applications of Microsystems in various industries.
UNIT II MECHANICS, SCALING AND DESIGN 9
Engineering Mechanics for Microsystems design: Introduction, Static bending of Thin Plates,
Mechanical Vibration, Thermomechanics, Thermofluid, Engineering and micro system design,
33
Laminar fluid flow, Incompressible fluid Flow, Heat conduction in solids-Scaling Laws in
Miniaturization, Introduction to scaling, Scaling in (Electrostatic forces electromagnetic forces,
Electricity, fluid mechanics, heat transfer)-Microsystems Design: Design Consideration, Process
design, Mechanical Design, Design of Micro fluidic Network systems
UNIT III MICRO SYSTEM FABRICATION PROCESSES 11
Introduction- Photolithography- Ion implantation- Chemical Vapor Deposition-Physical Vapor
Deposition - clean room- Bulk micromachining :etching, isotropic and anisotropic etching, wet and dry
etching- Surface micro machining :process, mechanical problems associated with surface micro
machining- LIGA process :general description, materials for substrates and photo resists-SLIGA
process-Abrasive jet micro machining-Laser beam micro machining- Micro Electrical Discharge Micro
Machining –Ultrasonic Micro Machining- Electro chemical spark micro machining- Electron beam
micro machining-Focused Ion Beam machining
UNIT IV MICROSYSTEMS PACKAGING 8
Introduction - Microsystems Packaging-Interfaces in Microsystems Packaging-Essential Packaging
Technologies- Die preparation, surface bonding, wire bonding, sealing- Three dimensional Packaging-
Assembly of Microsystems, Signal Mapping and Transduction
UNIT V MICROMETROLOGY AND CHARACTERIZATION 8
Microscopy and visualization- Lateral and vertical dimension- optical microscopy, Scanning white light
interferometry, Confocal Laser scanning microscopy, Molecular measuring machine, Micro
coordinate measuring machine- Electrical measurements – Physical and chemical analysis – XRDSEM
- Secondary Ion mass spectrometry- Auger Electron Spectroscopy, SPM
TOTAL: 45 PERIODS
OUTCOME:
At the end of this course the student will be able to apply the knowledge in mechanics, scaling,
design, fabrication and characterization of micro systems.
REFERENCES
1. Hsu, T.R., “MEMS & Microsystems Design and Manufacture”, Tata McGraw Hill, 2002,ISBN:
9780070487093.
2. Franssila, S., “Introduction to Micro Fabrication” John Wiley & sons Ltd, 2004.ISBN:470-85106-6
3. Jain, V.K., “Introduction to Micromachining” Narosa Publishing House, 2010.
4. Jackson, M.J., “Microfabrication and Nanomanufacturing” Taylor and Francis 2006.
5. McGeough, J.A., “Micromachining of Engineering Materials”, CRC Press, ISBN: 0824706447,
2001.
6. Hak M.G., “MEMS Handbook”, CRC Press, ISBN: 8493-9138-5, 2006.