CM7010 ELECTRONICS MANUFACTURING TECHNOLOGY Syllabus | Anna University ME

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Anna University Syllabus - Anna University ME Syllabus

CM7010 ELECTRONICS MANUFACTURING TECHNOLOGY Syllabus | Anna University ME Computer Integrated Manufacturing Second Semester Syllabus Regulation 2013. Below is the Anna University 2013 Regulation Syllabus for 2nd Semester for ME Computer Integrated Manufacturing, Textbooks, Reference books, Exam portions, Question Bank, Previous year question papers, Model question papers, Class notes, Important 2 marks, 8 marks, 16 marks topics.
It is applicable for all students admitted in the Academic year 2013-2014 onwards for all its Affiliated institutions in Tamil Nadu.

CM7010 ELECTRONICS MANUFACTURING TECHNOLOGY L T P C 3 0 0 3

OBJECTIVE:
 To impart the knowledge in electronic packaging technology
UNIT I INTRODUCTION TO ELECTRONICS MANUFACTURING 9
History, definition, wafer preparation by growing, machining, and polishing, diffusion, microlithography,
etching and cleaning, Printed Circuit Boards, types- single sided, double sided, multi layer and flexible
printed circuit board, design, materials, manufacturing, inspection. Electronic packaging – Through
Hole Technology (THT) and Surface Mount Technology (SMT)
25
UNIT II COMPONENTS AND PACKAGING 8
Through-hole components – axial, radial, multi leaded, odd form. Surface mount components- active,
passive. Interconnections - chip to lead interconnection, die bonding, wire bonding, TAB, Flip chip,
chip on board, multi chip module, direct chip array module, leaded, leadless, area array and
embedded packaging, miniaturization and trends.
UNIT III SOLDERING AND CLEANING 9
Soldering theory, effect of elemental constituents on wetting, microstructure and soldering, solder
paste technology – fluxing reactions, flux chemistry, solder powder, solder paste composition and
manufacturing, solder paste rheology, Wave soldering. Adhesive and solder paste application. solder
system variables. soldering temperature profile. Reflow soldering - profile generation and control,
soldering quality and defects. Post solder cleaning and selection. Measurement of cleanliness levels.
UNIT IV SURFACE MOUNT TECHNOLOGY: 11
SMT Equipment and Material Handling Systems, Handling of Components and Assemblies - Moisture
Sensitivity and ESD, Safety and Precautions Needed, IPC and Other Standards, Stencil Printing
Process, solder paste storage and handling, stencils and squeegees, process parameters, quality
control - Component Placement, Equipment Type, Chip shooter, IC placer, Flexibility, Accuracy of
Placement, Throughput, reflow soldering, adhesive, underfill and encapsulation process, applications,
storage and handling, process & parameters.
UNIT V INSPECTION, TEST AND REWORK FOR PCB: 8
Inspection Techniques, Equipment and Principle – AOI, X-ray. stencil printing process- defects &
corrective action, component placement process - defects & corrective action, Reflow Soldering
Process- defects & corrective action, underfill and encapsulation Process- defects & corrective
action, Testing of assemblies, In-circuit testing (ICT), functional testing, concept of yield, Rework and
Repair, tools, rework criteria and process, Design for - Manufacturability, Assembly, Reworkability,
Testing, Reliability and Environment.
TOTAL: 45 PERIODS
OUTCOME:
At the end of this course the student will be able to apply knowledge in various steps in electronics
packaging technology.
REFERENCES
1. Lee, N.C., “Reflow Soldering Process and Trouble Shooting – SMT, BGA, CSP and Flip Chip
Technologies”, Newnes Elsevier, 2001
2. Gurnett, K.W., “Surface Mount Handbook”, Newnes Elsevier , 1999
3. Seraphim, D., Lasky, R.C. and Che-Yu Li, “Principles of Electronic Packaging” Mcgraw Hill, 1989.
4. Strauss, R.,“ SMT Soldering Handbook”, Newnes Elsevier , 1998
5. Zant, P.V., “ Microchip Fabrication – a practical guide to semiconductor processing”McGraw Hill,
2000
6. Landers, T.L., “Electronics Manufacturing Processes”, Prentice Hall, 1998
7. Prasad R.P., “Surface Mount Technology: Principles and Practice”, New York: Chapman and Hall,
1997.
8. Coombs, Jr. C.E., “ Printed Circuits Handbook ” Mc Graw-Hill Hand books Sixth Edition, 2008