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MF3015 ELECTRONICS MANUFACTURING TECHNOLOGY SYLLABUS | ANNA UNIVERSITY BE MANUFACTURING ENGINEERING 8TH SEMESTER SYLLABUS REGULATION 2008 2011 2012-2013

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MF3015 ELECTRONICS MANUFACTURING TECHNOLOGY SYLLABUS | ANNA UNIVERSITY BE MANUFACTURING ENGINEERING 8TH SEMESTER SYLLABUS REGULATION 2008 2011 2012-2013 BELOW IS THE ANNA UNIVERSITY 8TH SEMESTER B.E MANUFACTURING ENGINEERING DEPARTMENT SYLLABUS, TEXTBOOKS, REFERENCE BOOKS,EXAM PORTIONS,QUESTION BANK,PREVIOUS YEAR QUESTION PAPERS,MODEL QUESTION PAPERS, CLASS NOTES, IMPORTANT 2 MARKS, 8 MARKS, 16 MARKS TOPICS. IT IS APPLICABLE FOR ALL STUDENTS ADMITTED IN THE YEAR 2011 2012-2013 (ANNA UNIVERSITY CHENNAI,TRICHY,MADURAI, TIRUNELVELI,COIMBATORE), 2008 REGULATION OF ANNA UNIVERSITY CHENNAI AND STUDENTS ADMITTED IN ANNA UNIVERSITY CHENNAI DURING 2009

MF3015 ELECTRONICS MANUFACTURING TECHNOLOGY LT P C
3 0 0 3
AIM:
To import knowledge on electronics manufacturing and packaging technology.
OBJECTIVE:
Upon the completion of the subject, student will be able to:
 Understand wafer preparation and PCB fabrication
 Know the types of Mounting Technologies and components for electronics
assembly
 Appreciate SMT process in detail.
 Know various Defects, Inspection Equipments SMT assembly process.
 Learn repair, rework and quality aspects of Electronics assemblies.
UNIT I INTRODUCTION TO ELECTRONICS MANUFACTURING 8
History, definition, wafer preparation by growing, machining, and polishing, diffusion,
microlithography, etching and cleaning, Printed circuit boards, types- single sided,
double sided, multi layer and flexible printed circuit board, design, materials,
manufacturing, inspection.
UNIT II COMPONENTS AND PACKAGING 8
Introduction to packaging, types-Through hole technology(THT) and Surface mount
technology(SMT), Through hole components – axial, radial, multi leaded, odd form.
Surface-mount components- active, passive. Interconnections - chip to lead
interconnection, die bonding, wire bonding, TAB, flip chip, chip on board, multi chip
module, direct chip array module, leaded, leadless, area array and embedded
packaging, miniaturization and trends.
UNIT III SURFACE MOUNT TECHNOLOGY PROCESS 12
Introduction to the SMT Process, SMT equipment and material handling systems,
handling of components and assemblies - moisture sensitivity and ESD, safety and
precautions needed, IPC and other standards, stencil printing process - solder paste
material, storage and handling, stencils and squeegees, process parameters, quality
control. Component placement- equipment type, flexibility, accuracy of placement,
throughput, packaging of components for automated assembly, Cp and Cpk and process
control. soldering- reflow process, process parameters, profile generation and control,
solder joint metallurgy, adhesive, underfill and encapsulation process - applications,
materials, storage and handling, process and parameters.
UNIT IV INSPECTION AND TESTING 9
Inspection techniques, equipment and principle - AOI, X-ray. Defects and Corrective
action - stencil printing process, component placement process, reflow soldering
process, underfill and encapsulation process, electrical testing of PCB assemblies- In
circuit test, functional testing, fixtures and jigs.
UNIT V REPAIR, REWORK, QUALITY AND RELIABILITY OF ELECTRONICS
ASSEMBLIES 7
Repair tools, methods, rework criteria and process, thermo-mechanical effects and
thermal management, Reliability fundamentals, reliability testing, failure analysis, design
for manufacturability, assembly, reworkability, testing, reliability, and environment.
TOTAL : 45 PERIODS
TEXT BOOKS
1. Surface Mount Technology –Principles and practice by Ray Prasad – second edition
, Chapman and Hall ,1997 ,New York , ISBN 0-41-12921-3
2. Fundamentals of microsystem packaging by Rao.R .Tummala, Mc -Graw Hill 2001 ,
ISBN 00-71-37169-9
72
REFERENCES
1. Failure Modes and Mechanisms in Electronic Packages, Puligandla Viswanadham
and Pratap Singh, Chapman and Hall, New York , N.Y. ISBN 0-412-105591-8.
2. Area Array Interconnection Handbook, Paul Totta and Karl Puttlitz, and Kathleen
Stalter , Kluwer Academic Publishers, Norwell, MA, USA, 2001.ISBN 0-7923-7919-5.
3. Reflow Soldering Process and Trouble Shooting SMT,BGA,CSP and Flip Chip
Technologies by Ning-Cheng Lee,Elsevier Science, ISBN 0-7506-7218-8.
4. Surface Mount Technology Terms and Concepts by Zarrow , Phil, Elsevier Science
and Technology,1997.ISBN 0750698756
5. Electronic Packaging and Interconnection Handbook, by C.A.Harper, Second
Edition, McGraw Hill Inc., New York, N.Y.,1997,ISBN 0-07-026694-8
6. www.ipc.org
7. www.smta.org

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