MF9213 ADVANCED MANUFACTURING PROCESSES SYLLABUS | ANNA UNIVERSITY ME MANUFACTURING ENGINEERING 1ST SEM SYLLABUS REGULATION 2009 2011 2012-2013 BELOW IS THE ANNA UNIVERSITY FIRST SEMESTER ME MANUFACTURING ENGINEERING DEPARTMENT SYLLABUS, TEXTBOOKS, REFERENCE BOOKS,EXAM PORTIONS,QUESTION BANK,PREVIOUS YEAR QUESTION PAPERS,MODEL QUESTION PAPERS, CLASS NOTES, IMPORTANT 2 MARKS, 8 MARKS, 16 MARKS TOPICS. IT IS APPLICABLE FOR ALL STUDENTS ADMITTED IN THE YEAR 2011 2012-2013 (ANNA UNIVERSITY CHENNAI,TRICHY,MADURAI,TIRUNELVELI,COIMBATORE), 2009 REGULATION OF ANNA UNIVERSITY CHENNAI AND STUDENTS ADMITTED IN ANNA UNIVERSITY CHENNAI DURING 2009
MF9213 ADVANCED MANUFACTURING PROCESSES L T P C
3 0 0 3
AIM:
To expose the students in the art of manufacturing new products due to the development
of new materials and processes. The students will totally get a feel of the relevant
suitable process while evaluating and deciding.
OBJECTIVES:
To inform the students about the various alternative manufacturing processes
available.
To develop an altitude to look for the unconventional manufacturing process to
machine
To make them to understand and appreciate the latest manufacturing process for
micro fabrication and devices.
UNIT I NEWER MACHINING PROCESSES - I 9
(Non thermal energy) – Abrasive machining – water jet machining - ultrasonic machining
– chemical machining – electro chemical machining – construction working principle –
steps - types – process parameters – derivations – problems, merits, demerits and
applications .
UNIT II NEWER MACHINING PROCESS – II 9
Wire cut EDM - Electro chemical machining – ECG - Electric discharge machining –
construction – principle – types – control - circuits – tool design – merits, demerits &
applications.
UNIT III NEWER MACHINING PROCESS – III 9
Laser beam machining – Electron beam machining – Plasma arc machining – Ion beam
machining – construction working principle types – process parameter – derivations –
problems, merits, demerits and applications.
UNIT IV FABRICATION OF MICRO DEVICES 9
Semiconductors – films and film depurification – Oxidation - diffusion – ion implantation –
etching – metallization – bonding – surface and bulk machining – LIGA Process – Solid
free form fabrication.
UNIT V MICROFABRICATION TECHNOLOGY 9
Wafer preparation – monolithic processing – moulding – PCB board hybrid & mcm
technology – programmable devices & ASIC – electronic material and processing.–
steriolithography SAW devices, Surface Mount Technology,
TOTAL: 45 PERIODS
REFERENCES:
1. Serope kelpekijian & stevan r. schmid- manufacturing process engg material – 2003
2. Micro senors Mems & smart devices- Julian W.Hardner – 2002
3. Brahem T. Smith, Advanced machining I.F.S. UK 1989.
4. Jaeger R.C., Introduction to microelectronic fabrication Addison Wesley, 1988.
5. Nario Taniguchi – Nano technology – Oxford University Press 1996.
6. Pandey P.C. & Shan HS Modern Machining Processes, Standard Publishing Co.,
1980
7. More Madon, Fundamentals of Microfabrication, CRC Press, 1997.
MF9213 ADVANCED MANUFACTURING PROCESSES L T P C
3 0 0 3
AIM:
To expose the students in the art of manufacturing new products due to the development
of new materials and processes. The students will totally get a feel of the relevant
suitable process while evaluating and deciding.
OBJECTIVES:
To inform the students about the various alternative manufacturing processes
available.
To develop an altitude to look for the unconventional manufacturing process to
machine
To make them to understand and appreciate the latest manufacturing process for
micro fabrication and devices.
UNIT I NEWER MACHINING PROCESSES - I 9
(Non thermal energy) – Abrasive machining – water jet machining - ultrasonic machining
– chemical machining – electro chemical machining – construction working principle –
steps - types – process parameters – derivations – problems, merits, demerits and
applications .
UNIT II NEWER MACHINING PROCESS – II 9
Wire cut EDM - Electro chemical machining – ECG - Electric discharge machining –
construction – principle – types – control - circuits – tool design – merits, demerits &
applications.
UNIT III NEWER MACHINING PROCESS – III 9
Laser beam machining – Electron beam machining – Plasma arc machining – Ion beam
machining – construction working principle types – process parameter – derivations –
problems, merits, demerits and applications.
UNIT IV FABRICATION OF MICRO DEVICES 9
Semiconductors – films and film depurification – Oxidation - diffusion – ion implantation –
etching – metallization – bonding – surface and bulk machining – LIGA Process – Solid
free form fabrication.
UNIT V MICROFABRICATION TECHNOLOGY 9
Wafer preparation – monolithic processing – moulding – PCB board hybrid & mcm
technology – programmable devices & ASIC – electronic material and processing.–
steriolithography SAW devices, Surface Mount Technology,
TOTAL: 45 PERIODS
REFERENCES:
1. Serope kelpekijian & stevan r. schmid- manufacturing process engg material – 2003
2. Micro senors Mems & smart devices- Julian W.Hardner – 2002
3. Brahem T. Smith, Advanced machining I.F.S. UK 1989.
4. Jaeger R.C., Introduction to microelectronic fabrication Addison Wesley, 1988.
5. Nario Taniguchi – Nano technology – Oxford University Press 1996.
6. Pandey P.C. & Shan HS Modern Machining Processes, Standard Publishing Co.,
1980
7. More Madon, Fundamentals of Microfabrication, CRC Press, 1997.
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